Current Issue: Vol. 4, Issue 6, December 2019
Frequency:  Bimonthly
ISSN Print:  2575-2022
ISSN Online:  2575-1468
Latest Articles
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Ma Shuyin
Pages: 149-153   Published Online: Dec. 7, 2019
DOI: 10.11648/j.eas.20190406.13
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Christian Kwaku Amuzuvi, Joseph Kwarteng, Emmanuel Aboah
Pages: 154-163   Published Online: Dec. 7, 2019
DOI: 10.11648/j.eas.20190406.14
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Gujanatti Rudrappa, Nataraj Vijapur
Pages: 144-148   Published Online: Dec. 6, 2019
DOI: 10.11648/j.eas.20190406.12
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Douglas Reward Kokah, Fou Ayebatin, Egai Ayibawari Obiene
Pages: 135-143   Published Online: Nov. 7, 2019
DOI: 10.11648/j.eas.20190406.11
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Wang Bin, Zang Deji, Yang Li
Pages: 129-134   Published Online: Oct. 17, 2019
DOI: 10.11648/j.eas.20190405.17
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Lory Marcus Parera, Thony Johny Tahalele, Conny Emilda Pelamonia
Pages: 123-128   Published Online: Oct. 15, 2019
DOI: 10.11648/j.eas.20190405.16
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Luo Zhenglin, Che Zhiyan, Zhang Haibin, Huang Dong
Pages: 111-117   Published Online: Sep. 30, 2019
DOI: 10.11648/j.eas.20190405.14
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Li Fenghui, Che Zhiyan, He Wei
Pages: 118-122   Published Online: Sep. 30, 2019
DOI: 10.11648/j.eas.20190405.15
View  90          Downloads  14
Ongoing Special Issues View All  
Development of Durability Evaluation Method of Excavator Swing Device Using Measurement

(Lead Guest Editor: Kiril Angelov )

Submission Deadline: Jul. 1, 2020

Smart Manufacturing and Smart Factory

(Lead Guest Editor: Lei Yue )

Submission Deadline: Apr. 1, 2020

New Strategies for the Recycling of Materials

(Lead Guest Editor: Marc Marin-Genesca )

Submission Deadline: Mar. 25, 2020

Engineering Projects and Studies Using Raspberry Pi

(Lead Guest Editor: Gulcicek Dere )

Submission Deadline: Feb. 25, 2020

Geophysical Data Processing and Interpretation

(Lead Guest Editor: Xu Zhang )

Submission Deadline: Feb. 10, 2020

Development of Durability Evaluation Method of Excavator Swing Device Using Measurement

(Lead Guest Editor: Byung-Ik Kang )

Submission Deadline: Jan. 15, 2020

Casting Industry

(Lead Guest Editor: Rasulov Fuzuli )

Submission Deadline: Jan. 10, 2020

Civil Engineering Construction Technology

(Lead Guest Editor: li zhengji )

Submission Deadline: Jan. 10, 2020

Research on Emerging Technologies in Design and Manufacturing

(Lead Guest Editor: Bharath V G )

Submission Deadline: Dec. 25, 2019

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Special Issue

Special issue is an effective way for researchers to focus on a hot topic for an in-depth study. If you have a great topic or idea, you can propose a special issue and you will have the opportunity to be the Lead Guest Editor of the special issue. For more information, please visit:

Propose a Special Issue

Benefits of the Lead Guest Editor

Once your proposal is accepted, you will serve as the Lead Guest Editor. Working with us as the Lead Guest Editor of your proposed special issue, you will be entitled the following benefits.

Publish one paper for free if your special issue finished successfully (i.e., at least 5 papers were published in the special issue).

Receive the Certificate of Honor (electronic version).

Receive a hard copy of the special issue for free when the special issue is finished successfully (if need).

Has a good chance to be promoted to the Editor-in-Chief of the Journal.

Keep himself up-to-date while reviewing a manuscript.

Cooperate with a group of experienced researchers from all over the world.

How to Propose a Special Issue

If you would like to propose a special issue for this journal and be the Lead Guest Editor, please check and fill the Proposal Form and send to

A Special Issue Proposal Should Include the Following 7 Parts:

Journal Title (The journal inside which you want to publish your special issue);

Special issue title;

Lead Guest Editor information;

At least 6 Guest Editors information;

Submission Deadline;

Description: A 150-400 words introduction about your special issue;

Aims and Scope of your special issue.

Editorial Board
Division of Railway Infra Business, LS Industrial System Co., Ltd, Anyang-Si, Gyeonggi-Do, South Korea
Manal Sorour
Food Engineering and Packaging Department, Food Technology Research Institute, Agricultural Research center, Cairo, Food Engineering and Packaging, Egypt
Peer Reviewer
Department of Electronics and Communication Engineering, Sree Vidhyanikethan Engineerng College, Tirupati, Andhra Pradesh, India
Kalchatla Riyazuddin
Department of Electronics and Communication Engineeering, Annamacharya Institute of Technology and Sciences, Rajampet, Andhra Pradesh, India
Xudong Wang
Analog Devices, Colorado Springs, Colorado, USA
Xingchun Li
Intelligent Manufacturing Department, Wuyi University, Jiangmen, Guangdong, China
Rajavel Balaguru
Building Solutions, Johnson Controls Inc, York, Pennsylvania, USA
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